Study of void observation technique using scanning electron microscopy
| Autor: | Naoma Ban, Takayuki Hoshino, Naomasa Suzuki, Satoshi Takada |
|---|---|
| Rok vydání: | 2013 |
| Předmět: |
Void (astronomy)
Interconnection Materials science business.industry Scanning electron microscope Monte Carlo method Condensed Matter Physics Line width Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Optics Cross section analysis Electrical and Electronic Engineering Signal intensity business Beam energy |
| Zdroj: | Microelectronic Engineering. 107:91-96 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2013.01.023 |
| Popis: | A non-destructive observation technique for sub-surface voids in Cu interconnect is required to enhance the effectiveness of metallization process development. In this work, the feasibility of high beam energy SEM is investigated through a case study of 25nm wide Cu interconnects. Also an optimization of SEM conditions is carried out using a Monte Carlo method based three dimensional SEM simulating tool. The capability of SEM based method for sub-surface void observation is confirmed by comparing top-down SEM image with cross section analysis. According to the Monte Carlo based optimization, for interconnects with 20-35nm line width, it is clarified that BSE imaging with beam energy of 8-10keV leads optimum sub-surface void visibility. In addition, authors evaluated the possibility of void size expectation, and it is confirmed that void size is reflected as signal intensity in SEM images. |
| Databáze: | OpenAIRE |
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