Impurity evaporation and void formation in Sn/Cu solder joints
| Autor: | Chih-Ming Chen, Chi-Wei Wang, Hsuan Lee, Chenju Liang, Hsuan-Ling Hsu |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Void (astronomy)
Materials science Kirkendall effect Scanning electron microscope 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences 0104 chemical sciences Outgassing Impurity Soldering General Materials Science Grain boundary Composite material 0210 nano-technology Electroplating |
| Zdroj: | Materials Chemistry and Physics. 225:153-158 |
| ISSN: | 0254-0584 |
| DOI: | 10.1016/j.matchemphys.2018.12.036 |
| Popis: | The existence of voids in the solder joints has been a serious reliability problem in microelectronics. A comprehensive understanding of the formation mechanism of voids is the cornerstone to solve the problem. This study reports an unusual phenomenon of voiding in the Sn/Cu solder joints and the most unique finding is that the voids were formed at the solder side (the Sn/Cu6Sn5 interface) rather than at the Cu side (the Cu3Sn/Cu interface) due to Kirkendall effect. Cross-sectional and topographic examination of the Sn/Cu interface using a scanning electron microscopy clearly positioned the voids on the surface of the Cu6Sn5 grains and their grain boundaries (triple junctions). Gas chromatograph (GC)/flame ionization detector (FID) microanalysis was performed to rationally correlate the outgassing of the Cu electroplated substrate and the void formation at the Sn/Cu6Sn5 interface. |
| Databáze: | OpenAIRE |
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