Impact of Self-Heating in Wire Interconnection on Timing

Autor:	Katsuhiro Furukawa, Masanori Hashimoto, Hiroo Masuda, Hidenari Nakashima, Tsuyoshi Sakata, Hiroshi Takafuji, Takashi Sato, Masakazu Tanaka, Koutaro Hachiya, Takaaki Okumura, Toshiki Kanamoto, Atsushi Kurokawa
Rok vydání:	2010
Předmět:	Engineering Interconnection business.industry Process (computing) Electrical engineering Integrated circuit Electronic Optical and Magnetic Materials law.invention Reduction (complexity) law Parasitic element Thermal System on a chip Electrical and Electronic Engineering business Data transmission
Zdroj:	IEICE Transactions on Electronics. :388-392
ISSN:	1745-1353 0916-8524
Popis:	This paper evaluates impact of self-heating in wire interconnection on signal propagation delay in an upcoming 32nm process technology, using practical physical parameters. This paper examines a 64-bit data transmission model as one of the most heating cases. Experimental results show that the maximum wire temperature increase due to the self-heating appears in the case where the ratio of interconnect delay becomes largest compared to the driver delay. However, even in the most significant case which induces the maximum temperature rise of 11.0°C, the corresponding increase in the wire resistance is 1.99% and the resulting delay increase is only 1.15%, as for the assumed 32nm process. A part of the impact reduction of wire self-heating on timing comes from the size-effect of nano-scale wires.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::45382aeb3e2d21f8e28eddfb76826b90 https://doi.org/10.1587/transele.e93.c.388 Zobrazit plný text záznamu