| Autor: |
Naoya Hirota, Sharon Pei Siang Lim, S. C. Chong, Masaya Kawano |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc47984.2019.9026703 |
| Popis: |
Ultrathin die pick-up is studied for 3D IC applications. Failure modes are identified as follows: 1) no pick-up due to insufficient peeling; 2) die crack created by ejector; 3) neighboring die crack due to ejector push-up. Optimal dicing tape is selected along with pick-up process tuning. By using optimal dicing tape, pick-up process window is identified for 20 and $30\ \mu \mathrm{m}$ thickness Si die with 8x8 and 12x12 mm die size. The failure modes of “die crack created by ejector” and “neighboring die crack” occur when push height is large and/or pickp-up time is short. The failure mode of “no pick-up” occurs at insufficient push height. Finally, pick-up conditions with 100% yield are identified with ≤ 1 sec pick-up time. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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