Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer
| Autor: | Defa Wang, Shuxin Niu, Xiaodong Wu, Y. Wang, Z.W. Yang |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Process Chemistry and Technology Diffusion Alloy 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Indentation hardness Surfaces Coatings and Films Electronic Optical and Magnetic Materials Atomic diffusion Diffusion layer visual_art 0103 physical sciences Materials Chemistry Ceramics and Composites Shear strength engineering visual_art.visual_art_medium Ceramic Composite material 0210 nano-technology |
| Zdroj: | Ceramics International. 47:130-137 |
| ISSN: | 0272-8842 |
| DOI: | 10.1016/j.ceramint.2020.08.115 |
| Popis: | Reliable joints of Ti3SiC2 ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti2Cu + TiCu/Ti5Si4 + TiSiCu/Cu(s, s)/Ti3SiC2. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti3SiC2/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti5Si4 and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti3SiC2 substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti3SiC2 ceramic. |
| Databáze: | OpenAIRE |
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