Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments

Autor:	I. Maus, Bruno Michel, Markus Fink, Kaspar M. B. Jansen, Bernhard Wunderle, Remi Pantou, H. Preu, M. Niessner
Rok vydání:	2014
Předmět:	Materials science business.industry Epoxy Viscoelasticity Characterization (materials science) Reliability (semiconductor) visual_art visual_art.visual_art_medium Microelectronics Relaxation (physics) Adhesive Electronics Composite material business
Zdroj:	2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Popis:	Microelectronic devices integrate more and more diverse materials in order to miniaturize the packages. Epoxy resins enable smaller electronic devices with promising features [1]. The performance and the reliability of the product are highly dependent on the material behavior of the components and on their interaction under different loading situation.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::448625e28546f0614c22641030ab428b https://doi.org/10.1109/eurosime.2014.6813833 Zobrazit plný text záznamu