Non-contact monitoring of current distribution in a PCB using 3D magnetic sensor

Autor:	Do Phuong Uyen Tran, Tien Anh Nguyen, Herve Mathias, Emile Martincic, Stephane Lefebvre, Pierre-Yves Joubert
Rok vydání:	2022
Zdroj:	2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
DOI:	10.1109/dtip56576.2022.9911734
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4479772ae25ac5faa23246db75d6356b https://doi.org/10.1109/dtip56576.2022.9911734 Zobrazit plný text záznamu