Challenges in Three-Dimensional Printing of High-Conductivity Copper

Autor: Jacquelynn Garofano, Ying She, T.I. El-Wardany, Joe J. Liou, Vijay Jagdale, Wayde R. Schmidt
Rok vydání: 2018
Předmět:
Zdroj: Journal of Electronic Packaging. 140
ISSN: 1528-9044
1043-7398
DOI: 10.1115/1.4039974
Popis: With recent advancements in additive manufacturing (AM) technology, it is possible to deposit copper conductive paths and insulation layers of an electric machine in a selective controlled manner. AM of copper enables higher fill factors that improves the internal thermal conduction in the stator core of the electric machine (induction motor), which will enhance its efficiency and power density. This will reduce the motor size and weight and make it more suitable for aerospace and electric vehicle applications, while reducing/eliminating the rare-earth dependency. The objective of this paper is to present the challenges associated with AM of copper coils having 1 × 1 mm cross section and complex features that are used in producing ultra-high efficiency induction motor for traction applications. The paper also proposes different approaches that were used by the authors in attempts to overcome those challenges. The results of the developed technologies illustrate the important of copper powder treatment to help in flowing the powder easier during deposition. In addition, the treated powder has higher resistance to surface oxidation, which led to a high reduction in porosity formation and improved the quality of the copper deposits. The laser powder direct energy deposition (LPDED) process modeling approach helps in optimizing the powder deposition path, the laser power, and feed rate that allow the production of porosity free thin wall and thin floor components. The laser powder bed fusion (LPBF) models identify the optimum process parameters that are used to produce test specimens with >90% density and minimum porosity.
Databáze: OpenAIRE