355nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates
| Autor: | X.C. Wang, Tupei Chen, B.K. Lok, D.K.Y. Low, Z.L. Li |
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| Rok vydání: | 2008 |
| Předmět: |
Heat-affected zone
Materials science Scanning electron microscope business.industry Laser cutting Mechanical Engineering Epoxy Laser Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention Printed circuit board Optics Optical microscope law visual_art visual_art.visual_art_medium Charring Electrical and Electronic Engineering Composite material business |
| Zdroj: | Optics and Lasers in Engineering. 46:404-409 |
| ISSN: | 0143-8166 |
| DOI: | 10.1016/j.optlaseng.2007.12.002 |
| Popis: | The 355 nm DPSS UV laser cutting of electronics printed circuit board (PCB) substrates including FR4, and BT/epoxy-based PCB substrates was investigated. The effects of various laser conditions such as scanning speed, assisting gas, repetition rate, and interval between scans on the heat affected zone (HAZ) and charring were studied. The quality and morphology of laser cut PCB substrates were evaluated with optical microscope, and scanning electron microscope (SEM). It was found that multi-pass cutting at high scanning speed can achieve high quality cutting with little charring. It was also found that with O 2 assist gas, a certain amount of interval time between scans and higher repetition rate led to less HAZ and less charring. High quality laser cutting of PCB substrates with no delamination, very little charring and minimum HAZ was demonstrated. The developed process has important potential applications in the electronics industry. |
| Databáze: | OpenAIRE |
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