Plasma doping: production worthy solution for 65nm and beyond technology nodes

Autor: Ziwei Fang, Harold M. Persing, Vikram Singh, Timothy J. Miller, Edwin A. Arevalo, Edmund J. Winder
Rok vydání: 2005
Předmět:
Zdroj: Extended Abstracts of the Fifth International Workshop on Junction Technology.
DOI: 10.1109/iwjt.2005.203885
Popis: 65nm and beyond advanced logic and DRAM devices will require decreasing junction depths and poly thickness at increasing doses. Present beam-line technology will suffer decreasing throughput during this transition as a result of space charge effects. Plasma doping is a well characterized alternative to beam-line technology that meets the doping requirements for
Databáze: OpenAIRE