Effect of Dealloying Process on Microstructure and Electrochemical Properties of Ni Foam
| Autor: | Lian Kui Wu, Ji Yu Li, Guangya Hou, Guo Qu Zheng, Yi Ping Tang, Hua Zhen Cao |
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| Rok vydání: | 2018 |
| Předmět: |
Materials science
Mechanical Engineering 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics Electrochemistry Microstructure 01 natural sciences 0104 chemical sciences Chemical engineering Mechanics of Materials Scientific method General Materials Science 0210 nano-technology |
| Zdroj: | Materials Science Forum. 922:3-7 |
| ISSN: | 1662-9752 |
| DOI: | 10.4028/www.scientific.net/msf.922.3 |
| Popis: | Ni foam with 3D porous structure has attracted attention in the field of catalysis. Expanding the specific surface area of Ni foam is an important method to enhance its chemical properties. In this study, the Cu-Ni/Ni foam were obtained by electroless plating copper on Ni foam and then heat treatment for homogenizing at 750°C. The dealloying of the Cu-Ni/Ni foam was carried out by electrochemical etching for obtaining the Ni foam with hierarchical pore structure. The microstructure, phase and electrochemical performance were characterized by SEM, XRD and electrochemical testing. The results showed that the optimized temperature of electroless plating Cu on Ni foam is 60oC. Ni-Cu alloy can be obtained by counter diffusion above 750°C. With prolonging time of etching, the content of Cu component decreased and the size of pores on the sturts of the Cu-Ni/Ni foam changed from nano to micro scale. The electrochemical properties of the alloywere significantly higher than that of the pure nickel foam. |
| Databáze: | OpenAIRE |
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