Atomic Layer Deposition of Ru for Replacing Cu-Interconnects

Autor:	Dip K. Nandi, Seung-Min Han, Young-Bae Park, Taehoon Cheon, Youn-Hye Kim, Ryosuke Harada, Shigeyuki Ohtake, Bonggeun Shong, Kirak Son, Yohei Kotsugi, Neung-Kyung Yu, Rahul Ramesh, Tomohiro Tsugawa, Soo-Hyun Kim
Rok vydání:	2021
Předmět:	Atomic layer deposition Materials science Chemical engineering General Chemical Engineering Materials Chemistry General Chemistry
Zdroj:	Chemistry of Materials. 33:5639-5651
ISSN:	1520-5002 0897-4756
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4355d3c2966c3cd8a4e85dfcf26c4264 https://doi.org/10.1021/acs.chemmater.1c01054 Zobrazit plný text záznamu