Study on fab environment induced Al and Cu metal corrosion by TEM failure analysis
| Autor: | Tan Pik Kee, Jeffrey Lam, Binghai Liu, Zhihong Mai, Zhao Yuzhe |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
Metallurgy chemistry.chemical_element 02 engineering and technology Contamination 021001 nanoscience & nanotechnology 01 natural sciences Copper Corrosion Wafer fabrication chemistry Transmission electron microscopy Aluminium 0103 physical sciences Chlorine Wafer 010306 general physics 0210 nano-technology |
| Zdroj: | 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). |
| Popis: | Contamination-free manufacturing environment is essential for semiconductor wafer fabs. Any contaminants from production line such as process tools and chambers need to be closely monitored and well controlled so as to avoid the direct exposure of the production wafers to these contaminants. In this paper, we discussed two typical metal corrosion issues induced by wafer fab environmental contamination, i.e. aluminum (Al) metal corrosion by fluorine (F)/chlorine (Cl), copper (Cu) metal corrosion by iodine (I). We presented detailed transmission electron microscope (TEM) analysis of the defects related to metal corrosion, helping fabs to identify the root cause and to take corrective actions. |
| Databáze: | OpenAIRE |
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