Autor:	Prabjit Singh, L. Palmer, M. Hamid, T. Wassick, R. F. Aspandiar, B. Franco, H. Fu, Richard Coyle, Faramarz Hadian, V. Vasudevan, A. Allen, K. Howell, K. Murayama, H. Zhang, A. Lifton, M. Ribas, M. Sarangapani, T. Munson, S. Middleton
Rok vydání:	2023
Zdroj:	2023 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep58572.2023.10129714
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::430421600ddd743bb9a08e3d99e1821d https://doi.org/10.23919/icep58572.2023.10129714 Zobrazit plný text záznamu