Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries

Autor:	Sumant Sood, Shari Farrens, Dave Pettit, Simon Kirk, Anthony B. Rardin
Rok vydání:	2010
Předmět:	Metal Materials science Surface preparation Anodic bonding Wafer bonding visual_art visual_art.visual_art_medium Point (geometry) Composite material
Zdroj:	ECS Transactions. 33:17-26
ISSN:	1938-6737 1938-5862
Popis:	Diffusion and eutectic bonding are gaining broad acceptance in 3D integration and packaging. Many bonding schemes are based on copper because this material is used extensively in FEOL, has a well developed CMP history and high yield TSV's have been proven. One of the issues for low resistivity interconnects and high bonding yield is the surface cleaning methods used to remove copper oxidation. This paper will present the results of studies using DuPont EKC products for copper surface preparation prior to wafer bonding.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::42d237cd2fcfa6fcbb11571dc1023e85 https://doi.org/10.1149/1.3483490 Zobrazit plný text záznamu