Resistive open defects detected by interconnect testing based on charge volume injected to 3D ICs
| Autor: | Hiroyuki Yotsuyanagi, Masaki Hashizume, Shyue-Kung Lu, Kouhei Ohtani, Naho Osato |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Resistive touchscreen Interconnection Materials science business.industry Spice Three-dimensional integrated circuit Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Test method 01 natural sciences Capacitance 020202 computer hardware & architecture law.invention Power (physics) Capacitor law 0103 physical sciences Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Optoelectronics business |
| Zdroj: | 2017 IEEE CPMT Symposium Japan (ICSJ). |
| Popis: | We have proposed a power supply circuit and an electrical interconnect test method based on charge volume supplied from the power supply circuit. We optimize the supply circuit so as for small resistive open defects that occur at interconnects among dies in 3D stacked ICs to be detected by the test method. We examine what resistive open defects can be detected with the optimized power supply circuit by Spice simulation. The simulation results show that resistive open defects of 1Ω and above can be detected by the test method with the power supply circuit. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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