Stress induced texture and shape memory trench in TiNiCu films

Autor:	WM Huang, Hejun Du, Wei Min Huang, Richard, Yong Qing FU
Rok vydání:	2011
Předmět:	Austenite Materials science Annealing (metallurgy) Metals and Alloys Surfaces and Interfaces Surface finish Sputter deposition Surfaces Coatings and Films Electronic Optical and Magnetic Materials Crystallography Martensite Trench Materials Chemistry Wafer Thin film Composite material
Zdroj:	Thin Solid Films. 519:5290-5296
ISSN:	0040-6090
DOI:	10.1016/j.tsf.2011.01.113
Popis:	Film texture and surface morphology of a crystallized TiNiCu film (deposited at 350 °C and post annealed at 450 °C in vacuum on a four inch wafer) have been characterized. X-ray diffraction analysis showed a preferred (002) martensite orientation at room temperature and a strong (110) austenite texture at temperature above 80 °C. Surface trenches were observed on the crystallized film surface at room temperature and disappeared when the film was heated to a high temperature above 80 °C. The formation of the strong texture and shape memory trenches is attributed to a significant stress evolution during post-annealing process. The variation of the trench morphology on the surface of the TiNiCu film surface over a four inch wafer after annealing has also been studied.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::419da28965e756b739beb779dfaf3677 https://doi.org/10.1016/j.tsf.2011.01.113 Zobrazit plný text záznamu Full Text from ScienceDirect