Fully Integrated Voltage Regulators with Package-Embedded Inductors for Heterogeneous 3D-TSV-Stacked System-in-Package with 22nm CMOS Active Silicon Interposer Featuring Self-Trimmed, Digitally Controlled ON-Time Discontinuous Conduction Mode (DCM) Operation

Autor:	Nachiket Desai, Harish K. Krishnamurthy, Suhwan Kim, Christopher Schaef, Sheldon Weng, Beomseok Choi, William J. Lambert, Krishnan Ravichandran, James W. Tschanz, Vivek De
Rok vydání:	2022
Zdroj:	2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
DOI:	10.1109/vlsitechnologyandcir46769.2022.9830385
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::419d9a4d3a72602036ff63fcb4216b69 https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830385 Zobrazit plný text záznamu