Next Gen Laser Assisted Bonding (LAB) Technology

Autor:	SeokHo Na, MinHo Gim, ChoongHoe Kim, DongHyeon Park, DongSu Ryu, DongJoo Park, JinYoung Khim
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00313
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::419336d3898c5d25d9d65770dc8db211 https://doi.org/10.1109/ectc51906.2022.00313 Zobrazit plný text záznamu