Signal transfer via smart conductive networks for high temperature performing wearable electronics
Autor: | Senem Kursun Bahadir, Ercan Karabulut |
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Rok vydání: | 2020 |
Předmět: |
010302 applied physics
Materials science Convective heat transfer business.industry Epoxy Welding Condensed Matter Physics 01 natural sciences Signal Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention Aramid law visual_art 0103 physical sciences Electronic component visual_art.visual_art_medium Optoelectronics Electrical and Electronic Engineering business Electrical conductor Data transmission |
Zdroj: | Journal of Materials Science: Materials in Electronics. 31:15996-16007 |
ISSN: | 1573-482X 0957-4522 |
DOI: | 10.1007/s10854-020-04161-5 |
Popis: | High temperature performing textile conductive networks for wearable electronic applications are demonstrated. Different types of conductive yarns, namely steel, copper, and silver-coated were used as signal transmission tracks in order to configure the smart conductive network architecture. Conductive networks were formed between the layers of high temperature-resistant fabric substrates which of the following substrates most likely consist of reactively sputtered aluminum particles, polybenzimidazoles (PBI), aramid, and glass fibers. The specimens were constructed using welding and conventional sewing techniques and their operating characteristics in terms of high temperature resistance (limited flame spread, convective heat transfer, radiant heat) and electrical properties (conductivity and signal quality in data transfer) were determined. As a result of thermal tests, the excellent performances among conductive networks are attributed to steel and copper threads used as signal transmission line hidden in the interface among aluminum, 100 % aramid (nonwoven), and epoxy layer used as a substrate. The efficient exploitation of smart conductive networks will boost the viability of data transfer quality among wearable electronic components performing at high temperatures. |
Databáze: | OpenAIRE |
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