Improved meshing strategy for finite element modeling of PBGA thermal cycling

Autor:	Jeffrey C. Suhling, Chienchih Chen, Pradeep Lall
Rok vydání:	2016
Předmět:	010302 applied physics Software business.industry Computer science Ball grid array Soldering 0103 physical sciences Temperature cycling Structural engineering business 01 natural sciences Joint (geology) Finite element method
Zdroj:	2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Popis:	Plastic Ball Grid Array (PBGA) technologies are among the most popular and cost effective methods for packaging of medium to high I/O count semiconductor chips. Computational simulations with three dimensional finite element analysis (FEA) software are often utilized to predict the stresses, strains, and deformations of PBGA assemblies subjected to thermal cycling. These simulation results are then coupled with appropriate failure criteria to estimate solder joint fatigue life.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4138562cb3540802b35c53223d6af6d6 https://doi.org/10.1109/itherm.2016.7517583 Zobrazit plný text záznamu