| Autor: |
Yang-Hsien Lee, Sian-Yi Yang, Keh-Moh Lin, Li-Kuo Wang, Ming-Yuan Huang, De-Chih Liu, Chien-Pin Chen, Yi-Chia Chen, Li-Wei Chen, Zhen-Cheng Wu |
| Rok vydání: |
2012 |
| Předmět: |
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| Zdroj: |
International Journal of Modern Physics: Conference Series. :43-48 |
| ISSN: |
2010-1945 |
| DOI: |
10.1142/s2010194512002917 |
| Popis: |
In this study, the quality degradation of Si -based photovoltaic (PV) modules during the aging process was observed by using electroluminescent (EL) technology and was verified by the IV curve measurements in order to find out the occurring timing of damages on solar cells. Furthermore, the influences of solder materials and soldering temperatures on the performance of the PV modules were also studied. Experiment results show that, high soldering temperatures which induce high thermal stress can easily lead to the power loss of the PV modules. Besides, the mechanical properties of the solar cells itself can also affect the degradation rate of the PV modules. On PV modules soldered with SnPb (SP) solder, more than 80% of cell damages occurred during the soldering and encapsulation processes. When SnAgPb (SAP) solder was used, a small part of the cell damages didn't emerge until the initial stage of the thermal cycling test (TC.) This phenomenon is attributed to the reduction of residual stress between the ribbon and the silver paste because of the good wettability of SAP solder. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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