The investigation of dry plasma technology in each steps for the fabrication of high performance redistribution layer
Autor: | Daisuke Hironiwa, Haw Wen Chen, Yasuhiro Morikawa, Takashi Kurimoto, Ryuichiro Kamimura |
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Rok vydání: | 2022 |
Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
DOI: | 10.1109/ectc51906.2022.00308 |
Databáze: | OpenAIRE |
Externí odkaz: |