A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors
| Autor: | Juergen Graf, K. Nötzold, Roland Müller-Fiedler |
|---|---|
| Rok vydání: | 2008 |
| Předmět: |
Engineering drawing
Materials science Silicon Electronic packaging chemistry.chemical_element Bending Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Glass frit bonding chemistry Ultimate tensile strength Fracture (geology) Electrical and Electronic Engineering Composite material Image warping Safety Risk Reliability and Quality Frit |
| Zdroj: | Microelectronics Reliability. 48:1562-1566 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2008.07.001 |
| Popis: | For increasingly miniaturized micromechanical sensors the silicon package is thinned and therefore more sensitive to thermomechanical stresses caused by the production stages. We present a four-point-bending-test that enables the investigation of reliability relevant loading like warping. The initiation of crack growth at the glass frit bonding frame is observed by an infrared camera and critical fracture mechanical parameters are determined for different tensile and shear mode contributions. Based on this crucial fracture mechanical data the stability of silicon packages can be assessed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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