Autor: |
D. A. Choutov, Kevin P. Martin, H. P. Gillis, M.B. Christopher |
Rok vydání: |
1999 |
Předmět: |
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Zdroj: |
MRS Internet Journal of Nitride Semiconductor Research. 4:834-839 |
ISSN: |
1092-5783 |
DOI: |
10.1557/s1092578300003495 |
Popis: |
Fabricating device structures from the III-N wide bandgap semiconductors requires anisotropoic dry etching processes that leave smooth surfaces with stoichiometric composition after transferring high-resolution patterns with vertical sidewalls. The purpose of this article is to describe results obtained by a new low-damage dry etching technique that provides an alternative to the standard ion-enhanced dry etching methods in meeting these demands for processing the III-N materials. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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