Design and implementation of a CMOS-MEMS microphone without the back-plate
| Autor: | Sung-Cheng Lo, You-Siang Chen, Wei-Jhih Mao, Weileun Fang, Chao-Lin Cheng |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Engineering business.industry Microphone Diaphragm (acoustics) Acoustics Electrical engineering Condenser microphone 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Substrate (building) Cmos mems 0103 physical sciences Electrode 0210 nano-technology business Cmos process Sensitivity (electronics) |
| Zdroj: | 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). |
| DOI: | 10.1109/transducers.2017.7994229 |
| Popis: | This study exploits the CMOS-MEMS technology to demonstrate a condenser microphone without back-plate. The reference sensing electrodes are fixed to the substrate, and thus no back-plate is required. To reduce the unwanted deformations resulted from the thin-film residual-stresses and temperature variation for the suspended CMOS-MEMS structures, the suspended acoustic diaphragm and sensing electrodes are respectively formed by the pure-dielectric and symmetric metal-dielectric layers. The design was implemented using TSMC 0.18μm 1P6M standard CMOS process, and the in-house post-CMOS releasing. Typical microphone with acoustic-diaphragm of 300μm-diameter and sensing-electrode of 50μm-long is fabricated and tested. Measurements indicate the sensitivity is −64dBV/Pa at 1kHz under 13.5V bias-voltage. The design enables the CMOS-MEMS microphone having good temperature stability between 30∼90°C. |
| Databáze: | OpenAIRE |
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