Characterization of interfacial delamination in multi-layered integrated circuit packaging
| Autor: | Bo Liu, Fei Shen, Huan Xu, Ming Xue, Alfred Yeo, Pamela Lin, Kun Zhou |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Delamination Constitutive equation Fracture mechanics 02 engineering and technology Surfaces and Interfaces General Chemistry Integrated circuit 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Finite element method Surfaces Coatings and Films law.invention Molecular dynamics law Indentation 0103 physical sciences Materials Chemistry Integrated circuit packaging Composite material 0210 nano-technology |
| Zdroj: | Surface and Coatings Technology. 320:349-356 |
| ISSN: | 0257-8972 |
| DOI: | 10.1016/j.surfcoat.2016.12.050 |
| Popis: | It is challenging to understand and predict interfacial delamination in multi-layered integrated circuit (IC) packaging due to the difficulties in experimentally quantifying the critical fracture energy of interfacial adhesion. This study takes a combined approach based on molecular dynamics (MD) simulation and finite element method (FEM) to characterize the interfacial fracture energy and predict delamination in the Cu/Ti/SiO 2 /Si multilayer systems. MD simulation is first conducted on each interface of the multiple layers at the atomistic level to obtain the material parameters such as the critical interfacial fracture energy that are required for the interfacial cohesive constitutive relation. Then, FEM is used to model and predict the interfacial delamination of the multi-layered system under indentation loading at the macroscale with the cohesive zone being considered around the delamination or crack tips. Finally, the indentation damage test is performed to validate the modeling results. The proposed combined modeling approach will have the potential to provide guidance in design and applications of IC packaging for improved stability and reliability. |
| Databáze: | OpenAIRE |
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