Copper plating for 3D interconnects

Autor:	Hugo Bender, Alex Radisic, Chris Drijbooms, Wouter Ruythooren, Harold Philipsen, S. Rodet, Ole Lühn, Zaid El-Mekki, M. Honore, Silvia Armini
Rok vydání:	2011
Předmět:	Materials science Plating Metallurgy Copper plating Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Microelectronic Engineering. 88:701-704
ISSN:	0167-9317
Popis:	In this paper we report on Cu plating of through-silicon-vias (TSV-s) using in-house made acidic Cu bath with model additives (SPS, PEG, and JGB). Although the model additives might not be as potent as commercial additives, they have been studied in detail, and their role in Cu plating has been described extensively in scientific literature. This in turn allows deeper insight into how changes in bath composition affect the plating mechanism and Cu via-fill.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4057f58d2bcbea2e79c61d67e1e32953 https://doi.org/10.1016/j.mee.2010.06.030 Zobrazit plný text záznamu Full Text from ScienceDirect