Control of copper nanoparticle metallization on electrospun fibers via Pd and Ag seed-assisted templating
| Autor: | Temitope Q. Aminu, David F. Bahr |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Materials science
Mechanical Engineering Polyacrylonitrile food and beverages chemistry.chemical_element Nanoparticle Copper Metal chemistry.chemical_compound symbols.namesake chemistry Chemical engineering Mechanics of Materials visual_art visual_art.visual_art_medium symbols General Materials Science Thermal stability Seeding Raman spectroscopy Palladium |
| Zdroj: | Journal of Materials Science. 56:16307-16323 |
| ISSN: | 1573-4803 0022-2461 |
| DOI: | 10.1007/s10853-021-06326-x |
| Popis: | We investigated the effects of palladium and silver seed chemistries on the electroless deposition of copper nanoparticles on electrospun polyacrylonitrile (PAN) fibers to identify conditions that enable formation of either conformal coatings or isolated metallic nanoparticles. The kinetics of Cu deposition was enhanced on Pd seeded fibers over Ag seeding, and continuous growth of copper nanoparticles conformal to the PAN fibers was achieved in instances with high seed density for both seed chemistries. A discrete distribution of copper nanoparticles was observed for low density silver seeding. Furthermore, the high density Ag seeds promoted dense and compact copper nanoparticle films, while the films on the Pd seeded fibers were rough with inclusions of microporosity. Raman spectroscopy revealed that a higher ratio of the D to G bands formed during processing, indicative of more cyclization of nitrile groups in surface PAN molecules during the seeding and deposition processes, corresponds to a higher seeding density. Thermal stability of PAN is enhanced with isolated Pd seeds present where the seed size is lower than the mean free path for electron conduction, but degrades as larger seeds or more dense and compact metallic shells are formed on the fibers. |
| Databáze: | OpenAIRE |
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