Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer
| Autor: | De Cao Niu, Wei Zhong Tang, Zheng Liu, Guang Chao Chen, Chengming Li, Hao Lan, Song Jianhua, Yu Mei Tong, Fan Xiu Lu |
|---|---|
| Rok vydání: | 2008 |
| Předmět: |
Materials science
Mechanical Engineering Material properties of diamond Relaxation (NMR) Metallurgy Diamond Substrate (electronics) engineering.material Condensed Matter Physics Cracking Carbon film Mechanics of Materials Thermal engineering Deposition (phase transition) General Materials Science Composite material |
| Zdroj: | Materials Science Forum. :996-1001 |
| ISSN: | 1662-9752 |
| Popis: | The effects of suppressing film cracking during large area freestanding diamond films deposition on Mo substrates with Ti interlayer were explored based on the finite-element code ANSYS. The analysis results were verified by experimental results. It showed that during large area freestanding diamond films deposition, Mo substrates with Ti interlayer have good effects on thermal stress relaxation and reduce the probability of crack initiation. High comprehensive quality diamond films were obtained at 950°C. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|