Flip Chip Bonded Optoelectronic Devices on Ultra-Thin Silicon-on-Sapphire for Parallel Optical Links

Autor:	M. Pendleton, Donald J. Albares, M. Wong, J. Cable, R. Athale, Ronald E. Reedy, C. Kunzia, J. Green
Rok vydání:	2001
Předmět:	Materials science Silicon on sapphire CMOS business.industry Detector Optoelectronics Mixed-signal integrated circuit business Flip chip
Zdroj:	Optics in Computing.
DOI:	10.1364/oc.2001.otha7
Popis:	We describe flip chip bonding of arrayed optoelectronic devices (VCSELs, MSM and PIN detectors) onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 2.5 Gbps (and higher) parallel optical links.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3f6f475f3de3eea1af84b2c0666e2f05 https://doi.org/10.1364/oc.2001.otha7 Zobrazit plný text záznamu