Fast TDDB monitoring for BEOL interconnect dielectrics

Autor: S. F. Yap, Andreas Kerber, Z. Chbili, Charles LaRow, T. Nigam
Rok vydání: 2017
Předmět:
Zdroj: 2017 IEEE International Integrated Reliability Workshop (IIRW).
DOI: 10.1109/iirw.2017.8361225
Popis: In this paper, we present a simple experimental setup to expand our fast TDDB methodology [1] into a broad voltage range covering FEOL and BEOL TDDB testing. The new setup uses a combination of standard (SMU) and fast measurement unit (FMU) in differential mode to expand the stress voltage range while collecting failure times in tens of microseconds. The new apparatus was used to perform TDDB on a BEOL structure collecting failures spanning over ten orders of magnitude in time. Using this new setup, differences between TDDB fitting models could be distinguished within 2 weeks of testing time.
Databáze: OpenAIRE