Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package

Autor:	Glenn A. Rinne, Wei Lin, Nathan Whitchurch, Devarajan Balaraman
Rok vydání:	2017
Předmět:	Materials science Silicon Strain (chemistry) business.industry chemistry.chemical_element Fine pitch Die (integrated circuit) chemistry Ball grid array Automotive Engineering Electronic engineering Optoelectronics business Flip chip
Zdroj:	International Symposium on Microelectronics. 2017:000176-000181
ISSN:	2380-4505
DOI:	10.4071/isom-2017-wa14_097
Popis:	A method for directly measuring the silicon strain in a flip chip ball grid array (FCBGA) package is disclosed. The method uses anisotropically etched holes in the die backside to reveal fiducial crosses on the front side of the die. A geometric model is proposed that allows extraction of the strain component of the measured displacement. A finite element model is described which correctly predicts the sign and magnitude of the strain.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3f47e447135e59035e77a460a5762acf https://doi.org/10.4071/isom-2017-wa14_097 Zobrazit plný text záznamu