A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform

Autor:	Eoin O'Toole, Jose Luis Silva, Filipe Cardoso, Jose Silva, Luis Alves, Marcio Souto, Nuno Delduque, Anibal Coelho, Jose Miguel Silva, WonChul Do, JinYoung Khim
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00135
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3f41026b0ffb3c1f9a16fa03b22aee6f https://doi.org/10.1109/ectc51906.2022.00135 Zobrazit plný text záznamu