Electromigration of Electroplated Gold Interconnects

Autor:	Steve Kilgore, Dieter Schroder, Haldane S. Henry, Craig A. Gaw, Darrell G. Hill
Rok vydání:	2005
Předmět:	Void (astronomy) Materials science Electronic engineering Film temperature Activation energy Stress conditions Composite material Electroplating Current density Electromigration Median time to failure
Zdroj:	MRS Proceedings. 863
ISSN:	1946-4274 0272-9172
Popis:	Electromigration tests were performed on passivated electroplated Au four terminal Kelvin line structures using the conventional in situ resistance monitoring technique. The stress conditions were a current density of 2.0 MA/cm2 with ambient temperatures ranging from 325°C to 375°C. The temperature coefficients of resistance (TCR) values were measured prior to current stressing to calculate the Joule heated film temperatures. The times to failure (lifetimes) for the Au line structures were considered as a 50% ΔR/R0 change. The median time to failure (t50%) was plotted against the inverse film temperature to determine the activation energy value as 0.59 ± 0.09 eV. Failure analysis of void location and suggested diffusion mechanism will be discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3f391aaf59dca6b84c4fff251167cc54 https://doi.org/10.1557/proc-863-b8.30 Zobrazit plný text záznamu Full text from SpringerLink