Effect of thickness of diamond coatings on the adhesive strength of film–substrate interface
| Autor: | X. G. Jian, Y. H. Zhang, L. D. Shi |
|---|---|
| Rok vydání: | 2015 |
| Předmět: |
Range (particle radiation)
Materials science Mechanical Engineering Diamond Substrate (electronics) engineering.material Condensed Matter Physics Adhesion strength Molecular dynamics Mechanics of Materials Cemented carbide engineering Coupling (piping) General Materials Science Composite material Morse potential |
| Zdroj: | Materials Research Innovations. 19:S10-190 |
| ISSN: | 1433-075X 1432-8917 |
| DOI: | 10.1179/1432891715z.0000000002143 |
| Popis: | Models of the interface between the diamond film with the thickness from 10 to 60 A and the cemented carbide substrate are built using the molecular dynamics method, and the interactions of the atoms in the models are represented by coupling Morse potential, Tersoff potential and Lennard-Jones potential. The mechanical properties of the models are studied in the form of simulation with the molecular dynamics software Lammps. The simulation results indicate that the adhesive strength of the model with the thickness of the diamond film 20 A reaches the maximum value of 25.80 GPa, and the adhesive strength declines and keeps stable with the value of 7.0 GPa when the range of the thickness of the diamond film is from 30 to 60 A. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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