| Autor: |
Hsueh-Kuo Liao, Wei-Hao Chi, Hao Chiang Hsu, Lu-Ken Cheng |
| Rok vydání: |
2020 |
| Předmět: |
|
| Zdroj: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact50485.2020.9268538 |
| Popis: |
In the paper, we introduce thermal, electrical and long term reliability characteristic of insulated metal substrate (IMS) and comparing to the conventional DBC+Baseplate structure. Thermal performance is determined by junction to case thermal resistance, and the result shows that the thermal resistance of aluminum base IMS is reduced about 2.7% compared to conventional structure. Moreover, copper base IMS can reduce another 18% of thermal resistance. In Q3D simulation, the stray inductance of IMS is smaller than conventional structure about 43%. From the reliability point of view, thermal cycle test is also performed for 200 cycles which temperature range from $-65 ^{\circ}{C}$ to $150 ^{\circ}{C}$ with dwell time 30 minutes. DBC+Baseplate structure generate severely delamination under CSAM inspection in first 50 cycles. In contract to DBC+Baseplate, IMS shows no defect to the end of the experiment. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
