Technical issues of stainless steel foil substrates for OLED display applications
| Autor: | Alex Z. Kattamis, I-Chun Cheng, Yongtaek Hong, Seungjun Chung, Sigurd Wagner |
|---|---|
| Rok vydání: | 2007 |
| Předmět: |
Materials science
business.industry Low-k dielectric Hardware_PERFORMANCEANDRELIABILITY Substrate (printing) Flexible display Thin-film transistor Chemical-mechanical planarization Hardware_INTEGRATEDCIRCUITS Surface roughness Electronic engineering Optoelectronics business Layer (electronics) FOIL method |
| Zdroj: | SPIE Proceedings. |
| ISSN: | 0277-786X |
| DOI: | 10.1117/12.737213 |
| Popis: | Key technical issues of flexible stainless steel foil substrates are addressed for OLED display backplane applications. Surface roughness and corresponding planarization layer technology development will be the major factors for the stainless steel foil substrates to be used for commercial applications. Promising candidates for the planarization layer materials are reviewed and some of the properties are addressed. In addition, if the substrate is sustained to a constant voltage for guaranteed circuit operation, capacitive coupling through the insulation and planarization dielectric layer, from the conductive substrate to the electrode and circuit elements on it, is also carefully analyzed for panel design and operation. Especially for large size high-resolution display applications, low k and thick planarization layer should be used. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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