| Autor: |
Yang Kai, Li He, Wang Xi, Zhang Jie |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
2021 China Semiconductor Technology International Conference (CSTIC). |
| DOI: |
10.1109/cstic52283.2021.9461518 |
| Popis: |
A micro soldering method based on micro gripping was developed to improve strength between bonding pad and wire. The designing and working principle of micro soldering set-up were based on micro gripper and microscopic vision guided motion of soldering iron tip. Strength comparative experiments between unsoldered and soldered bonding joints were conducted to demonstrate the bonding strength improvement brought by micro soldering procedure. X-ray microscopic computed tomography (CT) scanning results show maximum void diameter in the soldered binding joint is 97.905 µm. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
