Electroless Ni/Pd/Au Plating for Semiconductor Package Substrates (III) —Influence of the Electroless Pd Plating Thickness on the Solder Ball Joint Reliability and the IMC Growth

Autor:	Yoshinori Arayama, Takehisa Sakurai, Yoshinori Ejiri, Yoshiaki Tsubomatsu
Rok vydání:	2020
Předmět:	Crystallography Materials science Intermetallic Electrical and Electronic Engineering
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 23:230-238
ISSN:	1884-121X 1343-9677
DOI:	10.5104/jiep.23.230
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3e9e335467168aa35d8cbbdee5d625b1 https://doi.org/10.5104/jiep.23.230 Zobrazit plný text záznamu