Silicone perturbation of the polyamide-polyacrylate adhesive interface
| Autor: | Ian Harvey Arellano |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
business.industry Mechanical Engineering Intercalation (chemistry) 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences 0104 chemical sciences Secondary Ion Mass Spectroscopy Release agent chemistry.chemical_compound Silicone chemistry Mechanics of Materials Polyamide Microelectronics General Materials Science Adhesive Composite material 0210 nano-technology business Curing (chemistry) |
| Zdroj: | Materials Letters. 244:1-5 |
| ISSN: | 0167-577X |
| DOI: | 10.1016/j.matlet.2019.02.053 |
| Popis: | The polyamide-polyacrylate system is one of the most industrially applied substrate-adhesive systems in the microelectronics industry. The utilization of polyacrylate-based adhesives has grown significantly as interfacial material for mechanical support and as protective layers against foreign materials and chemical damage. Herein, we evaluate the adhesion between a pressure-sensitive polyacrylate-based adhesive and a polyamide substrate, and the effect of residual silicone, introduced as the adhesive material release agent. Spectral signatures of the polyacrylate-silicone intercalation, densification and fracture were determined via time-of-flight secondary ion mass spectroscopy (ToF-SIMS). Moreover, the nature and the integrity of the interfacial interaction between polyacrylate and polyamide in the presence of residual silicone after pressure application and adhesive curing were elucidated. The observed adhesion loss was rationalized based on the surface determinants derived from these spectral signatures. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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