| Autor: |
Yuichi Shibazaki, Hajime Yamamoto, Tomonori Dosho, Yujiro Hikida, Masahiro Morita, Yuji Shiba, Jay Brown, Takanobu Okamoto, Go Ichinose |
| Rok vydání: |
2017 |
| Předmět: |
|
| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| DOI: |
10.1117/12.2257659 |
| Popis: |
The final lithography accuracy is determined by what is known as the “on-product” performance, which includes product wafer-related errors and long-term stability. It is evident that on-product performance improvement is absolutely imperative now, and will become even more crucial in coming years. In order to meet customers’ future requirements, we have developed the next-generation lithography system focusing on wafer alignment advancements to improve onproduct performance. This newly developed wafer alignment system will help customers achieve their aggressive next-generation manufacturing accuracy and productivity requirements. In this paper, we describe the details of the new wafer measurement system and provide supporting performance data. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
