Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

Autor:	Takuro Suyama, Yusuke Nakagawa, Noriyuki Fujimori, Tsutomu Nakamura, Shimohata Takahiro, Kazuhiro Yoshida, Toshiro Sato, Takatoshi Igarashi
Rok vydání:	2017
Předmět:	010302 applied physics business.industry Computer science Mechanical Engineering 0103 physical sciences 02 engineering and technology Electrical and Electronic Engineering Image sensor 021001 nanoscience & nanotechnology 0210 nano-technology business 01 natural sciences Computer hardware
Zdroj:	IEEJ Transactions on Sensors and Micromachines. 137:48-58
ISSN:	1347-5525 1341-8939
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3e253ded3935393f137fefa4573969e4 https://doi.org/10.1541/ieejsmas.137.48 Zobrazit plný text záznamu