Autor: |
Li Diao, Ma Shawming, Mingjie Jiao, Lu Chen, Vijay M. Vaniapura, Linda Sui, Yi Wang, Yali Fu, Hongwei Chen |
Rok vydání: |
2019 |
Předmět: |
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Zdroj: |
2019 China Semiconductor Technology International Conference (CSTIC). |
Popis: |
CD trim process is incline to run on strip tool because of the low cost and high throughput benefit. However, CD stability is the key challenge. In this article, PR descum process for CD trim was studied on the chamber with substrate temperature |
Databáze: |
OpenAIRE |
Externí odkaz: |
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