Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding

Autor:	HongMiao Ji, King-Jien Chui
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663921
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3dc98906622880a3d071d9fe9e03b54d https://doi.org/10.1109/eptc53413.2021.9663921 Zobrazit plný text záznamu