Spatial composition variation in sputtered TiW films
| Autor: | B. R. Rogers, Timothy S. Cale |
|---|---|
| Rok vydání: | 1993 |
| Předmět: |
chemistry.chemical_classification
Auger electron spectroscopy Materials science Base (chemistry) Metals and Alloys Analytical chemistry Flux Surfaces and Interfaces Composition (combinatorics) Molecular physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Distribution function chemistry Materials Chemistry Wafer Deposition process |
| Zdroj: | Thin Solid Films. 236:334-340 |
| ISSN: | 0040-6090 |
| DOI: | 10.1016/0040-6090(93)90692-i |
| Popis: | We compare experimentally measured and simulated spatial composition variation in a TiW film sputtered into trenches on a patterned silicon wafer. Composition as a function of position down sidewalls of partially filled features of various aspect ratios were determined using Auger electron spectroscopy by analyzing selected points down exposed sidewalls. The atomic fraction of Ti increases as a function of distance into the trenches. The atomic fraction of Ti at the bases of trenches is significantly lower than on their sidewalls near the base. We test the effects of different sticking factors and flux distributions for Ti and W by comparing experimental composition profiles with those predicted using a physically based deposition process simulator, EVOLVE. We conclude that Ti has a lower effective sticking factor than W, which is assumed to be one. The effective sticking factor is the ratio of atoms permanently incorporated into the film, to the flux of incoming atoms for a given species. Although the difference in sticking factors seems to be one of the most significant causes of the spatial composition variation, different distribution functions from the source may also play a role. |
| Databáze: | OpenAIRE |
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