Bonding for 3-D Integration of Heterogeneous Technologies and Materials

Autor:	Christopher Gregory, Alan Huffman, M. R. Skokan, J. E. Robinson, P. R. Coffman, Dean Malta, Terry Welch, Dorota Temple, John Lannon, Matthew Lueck
Rok vydání:	2008
Předmět:	Fabrication Materials science law Microsystem Hardware_INTEGRATEDCIRCUITS High density Nanotechnology Integrated circuit Layer (object-oriented design) law.invention
Zdroj:	ECS Transactions. 16:3-13
ISSN:	1938-6737 1938-5862
Popis:	Modern electronic applications demand more and more complex, multifunctional microsystems with performance characteristics which can only be achieved by using best-of-breed materials and device technologies. Three-dimensional (3-D) integration of separate, individually complete device layers provides a way to build complex heterogeneous microsystems without compromising the system performance and fabrication yield. In the 3-D integration approach, each device layer is fabricated separately using optimized materials and processes. The layers are bonded and interconnected through area array vertical interconnects with lengths on the order of microns. This paper will review bonding techniques for high density area array 3-D integration of integrated circuits, focusing on techniques suitable for die-to-die and die-to-wafer bonding configurations.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3d970706100cdd4762bdba0cf3055c2f https://doi.org/10.1149/1.2982849 Zobrazit plný text záznamu