Approach for a Standardized Methodology for Multi-Site Processing of 300mm Wafers at R&D-Sites

Autor:	Lothar Pfitzner, Twan Bearda, H. Walther, Martin Schellenberger, V. Kaushik, M. Graef, J. Frickinger, Richard Oechsner, Heiner Ryssel, M. Lering, S. Hury, M. Fritzsche, D. Renaud, A. Danel, Markus Pfeffer, B. Murphy, Cor Claeys, Georg Roeder
Rok vydání:	2006
Předmět:	Engineering Computer architecture CMOS Wafer bonding Semiconductor device fabrication business.industry Multi site Electronic engineering Wafer business
Zdroj:	2006 IEEE International Symposium on Semiconductor Manufacturing.
DOI:	10.1109/issm.2006.4493143
Popis:	This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro and nano technologies to a distributed 300-mm CMOS R&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multisite processing. An implementation phase is planned as a second step.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::3d7fdbab6cfb2c9d06c0c021afd26360 https://doi.org/10.1109/issm.2006.4493143 Zobrazit plný text záznamu