Fuzzy Selection Model for Quality-Based IC Packaging Process Outsourcers
| Autor: | C. M. Yu, M. L. Huang, K. S. Chen |
|---|---|
| Rok vydání: | 2022 |
| Předmět: |
Process (engineering)
Computer science media_common.quotation_subject Quality (business) Integrated circuit packaging Electrical and Electronic Engineering Condensed Matter Physics Fuzzy logic Industrial and Manufacturing Engineering Selection (genetic algorithm) Electronic Optical and Magnetic Materials media_common Reliability engineering |
| Zdroj: | IEEE Transactions on Semiconductor Manufacturing. 35:102-109 |
| ISSN: | 1558-2345 0894-6507 |
| DOI: | 10.1109/tsm.2021.3125991 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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