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The gas-metal eutectic method was used to bond copper to sintered high alumina ceramics which had different sintering aid compositions in the magnesia-calcia-silica system. The highest average copper-alumina peel adhesion strength, 205 N/cm, was observed for alumina which contained 0.2 percent magnesia and 0.2 percent calcia. The lowest peel adhesion strength, 103 N/cm, was observed for copper bonded to 95 percent alumina which contained magnesia, calcia, and silica additions. This bond strength was similar to that for commercial 96 percent alumina. Statistical matrix experiments showed that alumina containing calcium silicate had significantly lower copper bond strength. This may be attributed to the formation of a transition compound other than the copper aluminate phase identified for well bonded samples in this study. 10 refs. |
